Books by author John H. Lau

Showing 1 – 13 out of 13 results

1. 

   Semiconductor Advanced Packaging

   John H. Lau | Springer Verlag, Singapore, 2022

   
   

   In stock at our supplier - Shipping in 5 - 8 days

   Language: English

   Binding: Paperback

   120.72 €

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2. 

   Mechanics of Solder Alloy Interconnects

   Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau | Springer, Berlin, 2007

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   205.49 €

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3. 

   Chiplet Design and Heterogeneous Integration Packaging

   John H. Lau | Springer Nature Singapore, 2024

   
   

   In stock at our supplier - Shipping in 8 - 11 days

   Language: English

   Binding: Paperback

   130.73 €

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4. 

   Semiconductor Advanced Packaging

   John H. Lau | Springer Verlag, Singapore, 2021

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   160.83 €

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5. 

   Fan-Out Wafer-Level Packaging

   John H. Lau | Springer Verlag, Singapore, 2018

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   150.83 €

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6. 

   Solder Joint Reliability

   John H. Lau | Van Nostrand Reinhold Inc.,U.S., 1991

   
   

   Low in stock at our supplier - Shipping in 11 - 15 days

   Language: English

   Binding: Hardback

   216.10 €

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7. 

   Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

   John H. Lau | Springer, Berlin, 2024

   
   

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   Language: English

   Binding: Hardback

   170.84 €

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8. 

   Chip On Board

   John H. Lau | Springer, Berlin, 1994

   
   

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   Language: English

   Binding: Hardback

   216.10 €

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9. 

   Assembly and Reliability of Lead-Free Solder Joints

   John H. Lau, Ning-Cheng Lee | Springer, Berlin, 2020

   
   

   In stock at our supplier - Shipping in 10 - 13 days

   Language: English

   Binding: Hardback

   160.83 €

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10. 

    Solder Joint Reliability

    John H. Lau | Springer-Verlag New York Inc., 2014

    
    

    In stock at our supplier - Shipping in 5 - 8 days

    Language: English

    Binding: Paperback

    205.49 €

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11. 

    Fan-Out Wafer-Level Packaging

    John H. Lau | Springer Verlag, Singapore, 2018

    
    

    In stock at our supplier - Shipping in 5 - 8 days

    Language: English

    Binding: Paperback

    110.62 €

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12. 

    Heterogeneous Integrations

    John H. Lau | Springer Verlag, Singapore, 2019

    
    

    In stock at our supplier - Shipping in 10 - 13 days

    Language: English

    Binding: Hardback

    160.83 €

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13. 

    Handbook Of Tape Automated Bonding

    John H. Lau | Van Nostrand Reinhold Inc.,U.S., 1992

    
    

    In stock at our supplier - Shipping in 10 - 13 days

    Language: English

    Binding: Hardback

    205.49 €

    Sale 7 %

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